Thermal

Leading telecom providers are diligently addressing various technical challenges to realize the full potential of 5G. This effort will result in a higher concentration of components within more compact spaces, driving the demand for effective electromagnetic compatibility (EMC) and thermal management solutions. 5G wireless technology is set to deliver reliable multi-gigabit peak data speeds, low … Read more

Saint-Gobain® Tape Solutions focuses on supporting customer needs through customization, testing, and simulation. The team often addresses thermal insulation and fire mitigation for EV battery packs, modules, and cells. Leveraging global teams, material expertise, and strong simulation and testing capabilities is crucial for meeting specific customer requirements and creating products tailored to diverse battery configurations. … Read more

High Performance High Flow Rate Fully Cured Dispensable Gel THERM-A-GAP GEL 60HF, part of the Parker Chomeric’s family, is a fully cured, one-component, silicone-based thermal interface material with a thermal conductivity of 6.2 W/m-K. Designed for high-performance heat transfer from electronic components to cooling features, it is suitable for a wide range of industries and … Read more

High Performance Non-Silicone Fully Cured Dispensable Gel THERM-A-GAP GEL 40NS is a high-performance, one-component, urethane-based thermal interface gel with a thermal conductivity of 4.0 W/m-K. It’s designed to transfer heat from electronics to a heat sink or enclosure. The “NS” suffix indicates it is non-silicone, making it suitable for applications where silicone contamination is a … Read more

Thermally Conductive Low Compression Force Gap Filler Pad Parker Chomerics THERM-A-GAP PAD 60 is a high-performance thermal interface material with a thermal conductivity of 6.0 W/m-K. It ensures superior heat transfer and requires low compression forces, maintaining excellent conformability between mating surfaces. The pad combines high thermal conductivity with low outgassing, making it an ideal … Read more

High Performance High Reliability Fully Cured Dispensable Thermal Gel Parker Chomerics THERM-A-GAP GEL 50VT is a reworkable, high-performance, one-component silicone thermal interface gel with a typical thermal conductivity of 5.2 W/m-K. This dispensable material is meticulously engineered to efficiently transfer heat from electronic components to heat sinks or enclosures, ensuring optimal performance even in vertical … Read more

3.5 W/m-K Cost Effective, High Reliability, Fully Cured, Dispensable Thermal Gel Parker Chomerics THERM-A-GAP GEL 35VT is an advanced one-component silicone thermal interface gel meticulously engineered for reworkability. With a thermal conductivity of 3.5 W/m-K, it is highly effective in transferring heat from electronic components to heat sinks or enclosures, making it particularly suitable for … Read more

8.3 W/m-K Thermally Conductive High Performance Gap Filler Pad The Parker Chomerics THERM-A-GAP™ PAD 80 is a high-performance, thermally conductive gap filler pad with a thermal conductivity of 8.3 W/m-K. It ensures excellent heat transfer across various thicknesses while maintaining low compression forces and conformability between mating surfaces. Designed to be an effective thermal interface, … Read more

Thermally Conductive Low Compression Force Gap Filler Pad Parker Chomerics THERM-A-GAP PAD 30 is a high-performance, thermally conductive, and electrically isolating gap filler pad with a thermal conductivity of 3.2 W/m-K. Engineered to deliver efficient heat transfer between electronic devices and heat sinks or other cooling components, THERM-A-GAP PAD 30 excels in balancing heat transfer … Read more

High Performance High Reliability Fully Cured Dispensable Thermal Gel Parker Chomerics THERM-A-GAP GEL 50VT is a reworkable, high-performance, one-component silicone thermal interface gel with a typical thermal conductivity of 5.2 W/m-K. This dispensable material is meticulously engineered to efficiently transfer heat from electronic components to heat sinks or enclosures, ensuring optimal performance even in vertical … Read more