Leading telecom providers are diligently addressing various technical challenges to realize the full potential of 5G. This effort will result in a higher concentration of components within more compact spaces, driving the demand for effective electromagnetic compatibility (EMC) and thermal management solutions.
5G wireless technology is set to deliver reliable multi-gigabit peak data speeds, low latency, and enhanced network capacity. This advanced performance will unlock new user experiences and facilitate the connection of diverse industries. With 5G, the true potential of the Internet of Things (IoT) can be realized, connecting machines, devices, and people seamlessly.
5G Operates at Significantly Higher Frequencies
At its core, 5G is an advanced iteration of 4G, operating not only on the same frequencies (700 MHz to 2.6 GHz) but also on a mid-range frequency band (2.5 to 6 GHz) and extending into ultra-high frequencies between 25 to 50 GHz.
However, 5G’s use of millimeter waves results in shorter transmission distances, necessitating a denser network infrastructure to maintain reliable signals. This requires a significant increase in the number of micro antennas, often placed on rooftops, streetlights, and traffic signals. These antennas are more compact than previous generations due to the shorter wavelengths, leading to an increased number of transmitter and receiver points compared to 4G technology.
While boosting power within this infrastructure can strengthen signals, it also generates additional heat on printed circuit boards (PCBs) and within integrated circuits (ICs).
Infrastructure Requirements for 5G
The network infrastructure supporting 5G faces challenges related to electromagnetic interference (EMI) and thermal management. Equipment like base stations, antennas, and electronics housings require specialized technologies and materials to mitigate EMI and ensure proper system functionality. Thermal interface materials (TIMs) are often necessary to manage excess heat and maintain components within their optimal operating temperatures.
Importance of Electromagnetic Compatibility (EMC)
5G infrastructure enclosures typically contain both transmitters and receivers, making EMI shielding essential to ensure electromagnetic compatibility (EMC). Proper shielding prevents interference and ensures harmonious operation of all circuitry.
Telecom providers must comply with global EMC standards to ensure that electronic equipment neither generates nor is affected by EMI. Insufficient EMI shielding can lead to device malfunctions, reduced performance, or interference with other electronic systems.
Compact EMI Shielding and Thermal Solutions for Smaller Devices
Today’s 5G infrastructure devices are considerably smaller than those of previous generations, with typical enclosures now measuring around 500mm x 250mm x 250mm. These devices often feature a metal cover acting as a heatsink, along with various smaller gaskets and compartmental shields to prevent crosstalk. The compact design of these devices presents challenges in providing sufficient EMI shielding.
Comprehensive EMI Shielding and Thermal Management Solutions
The most effective approach to resolving electromagnetic compatibility (EMC) issues is through the integration of filters and electrically conductive materials directly on the circuit board. Products like Parker Chomerics’ CHO-FORM Form-In-Place (FIP) gaskets are particularly well-suited for these applications, especially where space constraints and intercompartmental isolation are critical. CHO-FORM technology enables the precise dispensing of conformable gaskets in extremely small cross sections, freeing up valuable space on the circuit board.
Efficient heat dissipation is equally important in these densely packed environments to ensure that system components operate within the desired temperature range. Without proper thermal management, devices are prone to overheating, which can lead to system failures. THERM-A-GAP™ GEL 75 offers a solution to these challenges. This one-component, dispensable gel has a thermal conductivity of 7.5 W/m-K and can be applied in variable thicknesses to meet specific application needs, with automated dispensing providing precise and consistent application.
Matrix provides a complete electronics housing service, pre-assembling and dispensing its products directly into the housing, delivering a custom product or sub-system tailored to the customer’s design specifications. This approach simplifies material requirements and reduces inventory complexity, consolidating everything into a single stock-keeping unit.
When developing EMI or thermal interface solutions for telecom applications, various factors must be considered, including thermal impedance, shielding effectiveness, regulatory compliance, weight, cost, availability, and environmental characteristics.
Looking beyond telecom infrastructure, future 5G applications will expand into autonomous vehicles, connected wearables, smart homes, and smart city solutions, gradually replacing existing wired systems.
