High Performance High Reliability Fully Cured Dispensable Thermal Gel Parker Chomerics THERM-A-GAP GEL 50VT is a reworkable, high-performance, one-component silicone thermal interface gel with a typical thermal conductivity of 5.2 W/m-K. This dispensable material is meticulously engineered to efficiently transfer heat from electronic components to heat sinks or enclosures, ensuring optimal performance even in vertical … Read more
3.5 W/m-K Cost Effective, High Reliability, Fully Cured, Dispensable Thermal Gel Parker Chomerics THERM-A-GAP GEL 35VT is an advanced one-component silicone thermal interface gel meticulously engineered for reworkability. With a thermal conductivity of 3.5 W/m-K, it is highly effective in transferring heat from electronic components to heat sinks or enclosures, making it particularly suitable for … Read more
8.3 W/m-K Thermally Conductive High Performance Gap Filler Pad The Parker Chomerics THERM-A-GAP™ PAD 80 is a high-performance, thermally conductive gap filler pad with a thermal conductivity of 8.3 W/m-K. It ensures excellent heat transfer across various thicknesses while maintaining low compression forces and conformability between mating surfaces. Designed to be an effective thermal interface, … Read more
Thermally Conductive Low Compression Force Gap Filler Pad Parker Chomerics THERM-A-GAP PAD 30 is a high-performance, thermally conductive, and electrically isolating gap filler pad with a thermal conductivity of 3.2 W/m-K. Engineered to deliver efficient heat transfer between electronic devices and heat sinks or other cooling components, THERM-A-GAP PAD 30 excels in balancing heat transfer … Read more
High Performance High Reliability Fully Cured Dispensable Thermal Gel Parker Chomerics THERM-A-GAP GEL 50VT is a reworkable, high-performance, one-component silicone thermal interface gel with a typical thermal conductivity of 5.2 W/m-K. This dispensable material is meticulously engineered to efficiently transfer heat from electronic components to heat sinks or enclosures, ensuring optimal performance even in vertical … Read more
3.5 W/m-K Cost Effective, High Reliability, Fully Cured, Dispensable Thermal Gel Parker Chomerics THERM-A-GAP GEL 35VT is an advanced one-component silicone thermal interface gel meticulously engineered for reworkability. Featuring a notable thermal conductivity of 3.5 W/m-K, it is highly effective in transferring heat from electronic components to heat sinks or enclosures, making it particularly suitable … Read more
Thermally Conductive Low Compression Force Gap Filler Pad Parker Chomerics THERM-A-GAP PAD 30 is a high-performance, thermally conductive, and electrically isolating gap filler pad with a thermal conductivity of 3.2 W/m-K. Engineered to deliver efficient heat transfer between electronic devices and heat sinks or other cooling components, THERM-A-GAP PAD 30 excels in balancing heat transfer … Read more
8.3 W/m-K Thermally Conductive High Performance Gap Filler Pad The Parker Chomerics THERM-A-GAP™ PAD 80 is a high-performance, thermally conductive gap filler pad with a thermal conductivity of 8.3 W/m-K. It ensures excellent heat transfer across various thicknesses while maintaining low compression forces and conformability between mating surfaces. Designed to be an effective thermal interface, … Read more
Choosing the right silicone foam rubber for your needs can significantly impact the performance and reliability of your applications. Norseal F-20, with its impressive range of properties, offers a superior alternative to the Rogers HT800. Below is a detailed comparison to help you make an informed decision: Key Comparisons: Property Rogers HT800 Saint Gobain F-20 … Read more
Saint Gobain F-12 presents a compelling alternative to the Rogers BF1000, offering an array of benefits that make it a standout choice for various applications. Whether you need a material for high-stress environments, excellent fire safety, or specific environmental and electrical properties, Saint Gobain F-12 has you covered. Additionally, Saint Gobain is known for its … Read more
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