Selecting the right thermal gap filler is crucial for effective thermal management in electronic applications. In this blog post, we will compare three popular thermal gap filler products from Fujipoly, Laird, and Henkel, as well as Parker Chomerics’ THERM-A-GAP PAD 30. Each product offers unique advantages and can be suitable for different applications.
1. Therm-A-Gap PAD 80
Parker Chomerics THERM-A-GAPâ„¢ PAD 80 is a high-performance, thermally conductive gap filler with a thermal conductivity of 8.3 W/m-K. It provides exceptional heat transfer across different thicknesses, while offering low compression force and excellent conformability to mating surfaces. Engineered as an efficient thermal interface, the THERM-A-GAPâ„¢ PAD 80 is ideal for bridging thermal gaps between heat sinks and heat-generating components, even in applications with uneven surfaces or air gaps.
2. Fujipoly GR130A
Fujipoly’s GR130A is a high-performance gap filler known for its impressive thermal conductivity of 13.0 W/mK. It is an excellent option for applications that require efficient heat dissipation and minimal stress on components. The material features low thermal resistance and good compressibility, allowing it to fill gaps effectively. While its published thermal conductivity may be lower than that of competitors, this product is renowned for its reliable performance in ruggedized applications.
3. Laird Tflex SF10
Laird’s Tflex SF10 is designed for versatility and reliability across various environments, boasting a thermal conductivity rating of 10 W/mK. This silicone-based material has a soft, conformable nature that enables it to fill gaps well. Although it excels in adaptability, its lower thermal conductivity compared to both GR130A and THERM-A-GAP PAD 30 might limit its effectiveness in high-performance applications.
4. Henkel Bergquist TGP 10000
Henkel’s Bergquist TGP 10000 is engineered for high-performance applications, featuring a thermal conductivity rating of 10 W/mK as well. Known for its adhesive properties and ability to conform to irregular surfaces, this material provides reliable thermal performance. However, it tends to be more rigid than some competitors, which could affect its heat dissipation capabilities in specific use cases.
Conclusion
Each of the thermal gap fillers discussed has its own strengths and weaknesses, making them suitable for different applications. Fujipoly GR130A offers high thermal conductivity, while Laird Tflex SF10 provides versatility and conformability. Henkel’s TGP 10000 is notable for its adhesive properties, and Parker Chomerics’ THERM-A-GAP PAD 80 combines high thermal conductivity with durability.
When choosing the right thermal gap filler, consider your specific application requirements, such as thermal conductivity, compressibility, and adhesive properties, to ensure optimal thermal management and component performance.