Thermal

Double Sided Thermal Tapes The THERMATTACH T412 double-sided thermal interface tapes offer top-notch thermal conductivity and outstanding bonding capabilities between electronic components and heatsinks. Proven to deliver excellent reliability under thermal, mechanical, and environmental conditions, the THERMATTACH tape series ensures consistent performance. Leveraging thermal tapes enhances design flexibility and simplifies the complexity of electronic assemblies … Read more

Gap filler pads play a critical role in equipment maintenance and ensuring optimal device performance. These pads fill the minute gaps between components and casings, shielding sensitive equipment from potentially damaging high temperatures. Choosing the right material is paramount for effective protection. Thermal Gap Pad Comparison THERM-A-GAP PAD 30 THERM-A-GAP PAD 60 THERM-A-GAP PAD 70TP … Read more

High Performance Fully Cured Dispensable Gel Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP … Read more

High Performance High Flow Fully Cured Dispensable Gel THERM-A-GAP GEL 60HF is part of the Parker Chomerics family of fully cured, one component, silicone-based, dispensable thermal interface materials. With a 6.2 W/m-K thermal conductivity, it is designed for high performance heat transfer from electronics components to cooling features and meant to be used across industries … Read more

High Performance High Reliability Fully Cured Dispensable Thermal Gel Parker Chomerics THERM-A-GAPGEL 50VT is a reworkable, high performance, one-component silicone, dispensable thermal interface gel material with 5.2 W/m-K typical thermal conductivity. GEL 50VT was developed to conduct heat away from electronics to heat sinks or enclosures and to perform reliably in vertical and/or high vibration … Read more

High Performance Fully Cured Dispensable Thin Bond Line Gel Parker Chomerics THERM-A-GAP GEL 50TBL is a reworkable, high performance, one component, dispensable, thermal interface material with 5.0 W/m-K Bulk typical Thermal Conductivity. GEL 50TBL was developed to conduct heat away from electronics to a heat sink or enclosure at very thin bond lines. At minimum … Read more

Highly Reliable Fully Cured Dispensable GEL Parker Chomerics THERM-A-GAP GEL 20 is a moderate performance, one component, dispensable thermal interface material with 2.4 W/m-K thermal conductivity developed with high reliability for the automotive industry. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses up to 4mm to suit application needs. THERM-A-GAP GEL … Read more

Thermally Conductive Low Compression Force Gap Filler Pad Parker ChomericsTHERM-A-GAPPAD 30 is a thermally conductive, electrically isolating gap filler pad with a thermal conductivity of 3.2 W/m‐K. Designed to provide effective heat transfer between electronic devices, heat sinks, or other cooling features, THERM‐A‐GAP PAD 30 offers the ideal combination of heat transfer, low outgassing, and … Read more

Thermally Conductive Low Compression Force Thermal Putty Parker ChomericsTHERM‐A‐GAP PAD 70TP is a high performance, highly conformable thermally conductive gap filler pad with a typical thermal conductivity of 7.0 W/m‐K. It provides superior thermal performance and long‐term stability over conventional thermal pads with very low compression force. THERM‐A‐GAP PAD 70TP is designed to provide effective … Read more

Thermally Conductive High Performance Gap Filler Pad Parker ChomericsTHERM-A-GAP PAD 80 is a high performance, thermally conductive gap filler pad with a typical thermal conductivity of 8.3 W/m-K.THERM-A-GAPPAD 80 is designed to serve as an effective thermal interface between heat sinks and heat generating components on electronic devices where uneven surfaces, air gaps, and rough … Read more