Thermal

Phase-Change Thermal Interface Pads THERMFLOW® T766 stands out as an inherently adhesive phase change material safeguarded by a foil, meticulously crafted to fill interfacial air gaps and voids within electronic assemblies. Categorized as a Traditional Phase Change Material (PCM), THERMFLOW® materials retain solidity at room temperature, facilitating effortless handling and consistent application as dry pads … Read more

Phase-Change Thermal Interface Pads THERMFLOW® T725 represents a phase change substance tailored for vertical uses, engineered to occupy and seal interfacial air gaps and voids within electronic assemblies. Classified as a Traditional Phase Change Material (PCM), THERMFLOW® materials maintain solidity at room temperature, facilitating easy handling and consistent application as dry pads onto heat sinks … Read more

Phase-Change Thermal Interface Pads THERMFLOW® T710 represents a thermally enhanced phase change substance that necessitates minimal deflection force and is crafted to seamlessly occupy any interfacial air gaps and voids found within electronic assemblies. At ambient temperatures, THERMFLOW® materials retain a solid state, facilitating easy handling and consistent application as dry pads onto heat sinks … Read more

Double Sided Thermal Tapes The THERMATTACH T418 double-sided thermal interface tapes offer exceptional adhesion strength between electronic components and heatsinks, along with optimal conformability to components. Demonstrating outstanding reliability when subjected to thermal, mechanical, and environmental conditions, the THERMATTACH tape family ensures consistent performance. Utilizing thermal tapes enhances design flexibility and streamlines the complexity of … Read more

Double Sided Thermal Tapes The THERMATTACH T411 double-sided thermal interface tapes offer outstanding adhesion between electronic components and heat sinks, particularly effective on plastic packages and materials with low surface energy. Within the THERMATTACH tape range, these products demonstrate remarkable reliability under various thermal, mechanical, and environmental conditions. They enhance design flexibility and simplify electronics … Read more

Thermally Conductive Gap Filler Pads THERM-A-GAP 579 gap filler pads offer a solution with extremely low hardness (30 Shore 00) and boast a thermal conductivity of 3.0 W/m-K. The THERM-A-GAP 5XX series sheets and pads deliver outstanding thermal properties along with exceptional conformability, requiring minimal clamping forces. Representing an economical choice, THERM-A-GAP 579 combines excellent … Read more

Thermally Conductive Gap Filler Pads THERM-A-GAP 569 gap filler pads offer a solution with extremely low hardness (10 Shore 00) and boast a thermal conductivity of 1.5 W/m-K. The THERM-A-GAP 569 series sheets and pads deliver outstanding thermal properties along with exceptional conformability, requiring minimal clamping forces. Representing an economical choice, THERM-A-GAP 569 combines excellent … Read more

Double Sided Thermal Tapes The THERMATTACH T412 double-sided thermal interface tapes offer top-notch thermal conductivity and outstanding bonding capabilities between electronic components and heatsinks. Proven to deliver excellent reliability under thermal, mechanical, and environmental conditions, the THERMATTACH tape series ensures consistent performance. Leveraging thermal tapes enhances design flexibility and simplifies the complexity of electronic assemblies … Read more

Gap filler pads play a critical role in equipment maintenance and ensuring optimal device performance. These pads fill the minute gaps between components and casings, shielding sensitive equipment from potentially damaging high temperatures. Choosing the right material is paramount for effective protection. Thermal Gap Pad Comparison THERM-A-GAP PAD 30 THERM-A-GAP PAD 60 THERM-A-GAP PAD 70TP … Read more

High Performance Fully Cured Dispensable Gel Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP … Read more