Phase-Change Thermal Interface Pads
THERMFLOW® T725 represents a phase change substance tailored for vertical uses, engineered to occupy and seal interfacial air gaps and voids within electronic assemblies. Classified as a Traditional Phase Change Material (PCM), THERMFLOW® materials maintain solidity at room temperature, facilitating easy handling and consistent application as dry pads onto heat sinks or component surfaces. As temperatures rise during component operation, the THERMFLOW® material softens, allowing it to conform seamlessly to mating surfaces with minimal clamping pressure. Upon reaching the requisite melt temperature, the pad undergoes a complete phase change, achieving a minimum bond-line thickness (MBLT) of less than 0.001 inch or 0.0254mm, and maximal surface wetting. Consequently, this results in negligible thermal contact resistance owing to an extremely thin thermal resistance path.
PRODUCT FEATURES:
- Low thermal impedance
- Demonstrated reliability through thermal cycling and accelerated age testing
- Can be pre-applied to heat sinks
- Protective release liners prevent contamination
- Available in custom die-cut shapes and kiss-cut on rolls
- RoHS compliant
IDEAL APPLICATIONS:
- Microprocessors
- Graphics processors
- Chipsets
- Memory Modules
- Power Modules
- Power Semiconductors
PRODUCT ATTRIBUTES:
- Excellent thermal performance
- Inherently tacky
- No adhesive required
- Ideal for vertical applications
- Sticky nature limits flowing in vertical applications
- Tabs available for easy removal
- UL 94 V-0 flammability rated
| THERMFLOW Comparison | ||||
|---|---|---|---|---|
 |
T710 with PSA | T725 | T766/T766-06 | T777 |
 |
Request Sample | Request Sample | Request Sample | Request Sample |
| Colour | Light Gray/Off-White | Pink | Purple/Gray Foil | Gray |
| Carrier | 2 mil Fiberglass | None – Free Film | 1 mil Metal Foil | None – Free Film |
| Standard Thickness, in (mm) | 0.0055 (0.138) | 0.005 (0.125) | 0.0035 (0.088) 0.006 (0.152) |
0.0045 (0.115) |
| Specific Gravity | 1.15 | 1.1 | 2.6 | 1.95 |
| PRICE (Request Quote) |
$$ | $$ | $$ | $$$ |
| Phase Transition Temperature (C) | 45 | 55 | 55 | 45/62*** |
| Thermal Impedance @ 70 C, C-in^2/W (C-cm^2/W) @ 10 psi (69 kPa) @ 25 psi (172 kPa) @ 50 psi (345 kPa) |
Minimum Bond-line Thickness @ 50 C 0.023 (1.48) 0.16 (1.03) 0.12 (0.77) |
2.9 mil 0.11 (0.71) 0.06 (0.39) 0.04 (0.26) |
Minimum Bond-line Thickness 0.15 (0.97) 0.09 (0.58) 0.06 (0.39) |
Minimum Bond-line Thickness 0.02 (0.13) 0.015 (0.097) 0.0055 (0.035) |
| Operating Temperature Range, F (C) | -67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
(CLICK HERE TO DOWNLOAD T725 SPEC SHEET)
Matrix specializes in precision slitting of tapes to meet the exact specifications required by manufacturers. Our state-of-the-art equipment and expertise ensure precise customization, providing manufacturers with tailored solutions to enhance their product quality and performance.
Matrix Technology is the only authorized distributor of Parker Chomerics products in Canada. We have been working with Canadian engineers and technology companies for 45 years as Canada’s premier engineered materials partner, and have been converting products into customized solutions ever since.
