Phase-Change Thermal Interface Pads
THERMFLOW® T710 represents a thermally enhanced phase change substance that necessitates minimal deflection force and is crafted to seamlessly occupy any interfacial air gaps and voids found within electronic assemblies. At ambient temperatures, THERMFLOW® materials retain a solid state, facilitating easy handling and consistent application as dry pads onto heat sinks or component surfaces. As temperatures rise to operational levels, the THERMFLOW® material softens, allowing it to conform effortlessly to mating surfaces with gentle clamping pressure. Upon reaching the designated melting point, the pad undergoes a complete phase change, achieving a minimum bond-line thickness (MBLT) of less than 0.001 inch or 0.0254mm, along with optimal surface wetting. Consequently, this minimizes thermal contact resistance by establishing an extremely narrow thermal resistance path.
PRODUCT FEATURES:
- Low thermal impedance
- Demonstrated reliability through thermal cycling and accelerated age testing
- Can be pre-applied to heat sinks
- Protective release liners prevent contamination
- Available in custom die-cut shapes and kiss-cut on rolls
- RoHS compliant
IDEAL APPLICATIONS:
- Microprocessors
- Graphics processors
- Chipsets
- Memory Modules
- Power Modules
- Power Semiconductors
PRODUCT ATTRIBUTES:
- General use material
- Good thermal material
- Low deflection force required
- Fiberglass provides dielectric standoff
- Only available with adhesive
- Tabs available for easy removal
| THERMFLOW Comparison | ||||
|---|---|---|---|---|
 |
T710 with PSA | T725 | T766/T766-06 | T777 |
 |
Request Sample | Request Sample | Request Sample | Request Sample |
| Colour | Light Gray/Off-White | Pink | Purple/Gray Foil | Gray |
| Carrier | 2 mil Fiberglass | None – Free Film | 1 mil Metal Foil | None – Free Film |
| Standard Thickness, in (mm) | 0.0055 (0.138) | 0.005 (0.125) | 0.0035 (0.088) 0.006 (0.152) |
0.0045 (0.115) |
| Specific Gravity | 1.15 | 1.1 | 2.6 | 1.95 |
| PRICE (Request Quote) |
$$ | $$ | $$ | $$$ |
| Phase Transition Temperature (C) | 45 | 55 | 55 | 45/62*** |
| Thermal Impedance @ 70 C, C-in^2/W (C-cm^2/W) @ 10 psi (69 kPa) @ 25 psi (172 kPa) @ 50 psi (345 kPa) |
Minimum Bond-line Thickness @ 50 C 0.023 (1.48) 0.16 (1.03) 0.12 (0.77) |
2.9 mil 0.11 (0.71) 0.06 (0.39) 0.04 (0.26) |
Minimum Bond-line Thickness 0.15 (0.97) 0.09 (0.58) 0.06 (0.39) |
Minimum Bond-line Thickness 0.02 (0.13) 0.015 (0.097) 0.0055 (0.035) |
| Operating Temperature Range, F (C) | -67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
(CLICK HERE TO DOWNLOAD T710 SPEC SHEET)
Matrix specializes in precision slitting of tapes to meet the exact specifications required by manufacturers. Our state-of-the-art equipment and expertise ensure precise customization, providing manufacturers with tailored solutions to enhance their product quality and performance.
Matrix Technology is the only authorized distributor of Parker Chomerics products in Canada. We have been working with Canadian engineers and technology companies for 45 years as Canada’s premier engineered materials partner, and have been converting products into customized solutions ever since.
