Gap filler pads play a critical role in equipment maintenance and ensuring optimal device performance. These pads fill the minute gaps between components and casings, shielding sensitive equipment from potentially damaging high temperatures. Choosing the right material is paramount for effective protection.
Thermal Gap Pad Comparison | ||||
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THERM-A-GAP PAD 30 | THERM-A-GAP PAD 60 | THERM-A-GAP PAD 70TP | THERM-A-GAP PAD 80 | |
Request Sample | Request Sample | Request Sample | Request Sample | |
THERMAL CONDUCTIVITY | 3.2 w/M-k | 6.0 W/m-K | 7.0 W/m-K | 8.3 W/m-K |
DUROMETER | 30 (Shore 00) | 40 (Shore 00) | 15 (Shore 00) | 35 (Shore 00) |
THERMAL IMPEDANCE | 0.6 C-cm2/W | 0.24 C-cm2/W | 0.27 C-cm2/W | 0.15 C-cm2/W |
PRICE (Request Quote) |
$ | $$ | $$ | $$$ |
DIELECTIC STRENGTH | 150 VAC/mil (5.9KVAC/mm) | 127 VAC/mil (5.0kVAC/mm) | 127 VAC/mil (8.0kVAC/mm) | 125 VAC/mil (8.0kVAC/mm) |
DIELECTRIC CONSTANT | 8.0 @ 1000 kHz | 9.3 @ 1000 kHz | 5.6 @ 1000 kHz | 6.0 @ 1000 kHz |
OUTGASSING TOTAL MASS LOSS | 0.10% (0.04% CVCM) | 0.05% (0.01% CVCM) | 0.05% (0.01 CVCM) | 0.11% (0.01% CVCM |
FLAMMABILITY RATING | UL 94 V-0 | UL 94 V-0 | UL 94 V-0 | UL 94 V-0 |
SPECIFIC GRAVITY | 2.9 | 3.3 | 3.3 | 3.4 |
DEFLECTION AT PRESSURE | 51% @ 50 psi (345 kPa) | 38% @ 50 psi (345 kPa) | 38 % @ 50 psi (345 kPa) | 64% @ 50 psi (345 kPa) |
HEAT CAPACITY | 1 J/g-K | 1 J/g-K | 0.72 J/g-K | 1.00 J/g-K |
SHELF LIFE | 36 months | 18 months | 24 months | 36 months |
Protecting equipment from overheating using thermal pads is crucial for several reasons:
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Prevention of Component Damage: Overheating can lead to damage or degradation of sensitive electronic components. Excessive heat can cause components to malfunction, degrade, or even fail entirely, leading to costly repairs or replacements.
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Maintenance of Optimal Performance: Electronic devices often have specific operating temperature ranges within which they perform optimally. Overheating can push devices beyond these limits, leading to reduced performance or even complete shutdowns. By using thermal pads to dissipate heat effectively, equipment can maintain optimal performance levels over extended periods.
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Extended Lifespan: Excessive heat can significantly reduce the lifespan of electronic equipment. By ensuring that components operate within their recommended temperature ranges, thermal pads help extend the lifespan of devices, reducing the frequency of replacements and lowering overall costs.
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Prevention of Thermal Throttling: Many electronic devices, such as computers and smartphones, employ thermal throttling mechanisms to protect themselves from overheating. When temperatures rise beyond a certain threshold, these devices automatically reduce their performance to prevent damage. Thermal pads can help mitigate heat buildup, reducing the likelihood of thermal throttling and ensuring consistent performance.
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Avoidance of Safety Risks: Overheating can pose safety risks, especially in environments where electronic equipment is used near flammable materials or in confined spaces. By effectively dissipating heat, thermal pads help mitigate these risks and ensure the safe operation of equipment.
The THERM-A-GAPâ„¢ PAD 70TP Thermally Conductive Gap Filler Pad is meticulously engineered to facilitate efficient heat transfer in electronic systems. With its unique composition and exceptional properties, this product offers a valuable solution for thermal management challenges.
Characterized by its ultra-soft texture and remarkable conformability, the THERM-A-GAP PAD 70TP boasts a low hardness rating of 15 Shore 00 and an impressive thermal conductivity of 7.0W/m-K. Designed specifically to improve heat dissipation between electronic components and cooling elements such as heat sinks, this pad stands out as a top-performing thermal interface material. One of its key features is the TP (thermal putty) composition, which enables seamless gap filling upon compression, ensuring optimal thermal performance with minimal force. This innovative design outperforms traditional pads, providing superior thermal efficiency in various applications. The THERM-A-GAP PAD 70TP minimizes outgassing, ensuring effective thermal interface even on uneven surfaces. Its adaptability allows for custom manufacturing to fit specific component sizes, and it comes with carrier options like woven glass and aluminum foil, offering enhanced tear resistance and ease of handling.
Suitable for industries such as automotive, defense, aerospace, and telecom, this pad offers numerous benefits including high thermal conductivity, ease of application, low deflection force, electrical isolation, and minimal oil bleeding.
(CLICK HERE TO DOWNLOAD THERM-A-GAP PAD 70TP SPEC SHEET)
Matrix Technology is the only authorized distributor of Parker Chomerics products in Canada. We have been working with Canadian engineers and technology companies for 45 years as Canada’s premier engineered materials partner.