Phase-Change Thermal Interface Pads
THERMFLOW® T766 stands out as an inherently adhesive phase change material safeguarded by a foil, meticulously crafted to fill interfacial air gaps and voids within electronic assemblies. Categorized as a Traditional Phase Change Material (PCM), THERMFLOW® materials retain solidity at room temperature, facilitating effortless handling and consistent application as dry pads onto heat sinks or component surfaces. As temperatures escalate during component operation, the THERMFLOW® material softens, enabling it to seamlessly conform to both mating surfaces with gentle clamping pressure. Upon reaching the necessary melt temperature, the pad undergoes a complete phase transition, achieving a minimal bond-line thickness (MBLT) of less than 0.001 inch or 0.0254mm, along with maximal surface wetting. Consequently, this leads to practically nonexistent thermal contact resistance, attributed to an exceedingly diminutive thermal resistance path.
PRODUCT FEATURES:
- Low thermal impedance
- Demonstrated reliability through thermal cycling and accelerated age testing
- Can be pre-applied to heat sinks
- Protective release liners prevent contamination
- Available in custom die-cut shapes and kiss-cut on rolls
- RoHS compliant
IDEAL APPLICATIONS:
- Microprocessors
- Graphics processors
- Chipsets
- Memory Modules
- Power Modules
- Power Semiconductors
PRODUCT ATTRIBUTES:
- Excellent thermal performance
- Protective foil eliminates top liner
- Inherently tacky
- No adhesive required
- Sticky nature limits flowing in vertical applications
- Also available at 0.006″” thick
| THERMFLOW Comparison | ||||
|---|---|---|---|---|
 |
T710 with PSA | T725 | T766/T766-06 | T777 |
 |
Request Sample | Request Sample | Request Sample | Request Sample |
| Colour | Light Gray/Off-White | Pink | Purple/Gray Foil | Gray |
| Carrier | 2 mil Fiberglass | None – Free Film | 1 mil Metal Foil | None – Free Film |
| Standard Thickness, in (mm) | 0.0055 (0.138) | 0.005 (0.125) | 0.0035 (0.088) 0.006 (0.152) |
0.0045 (0.115) |
| Specific Gravity | 1.15 | 1.1 | 2.6 | 1.95 |
| PRICE (Request Quote) |
$$ | $$ | $$ | $$$ |
| Phase Transition Temperature (C) | 45 | 55 | 55 | 45/62*** |
| Thermal Impedance @ 70 C, C-in^2/W (C-cm^2/W) @ 10 psi (69 kPa) @ 25 psi (172 kPa) @ 50 psi (345 kPa) |
Minimum Bond-line Thickness @ 50 C 0.023 (1.48) 0.16 (1.03) 0.12 (0.77) |
2.9 mil 0.11 (0.71) 0.06 (0.39) 0.04 (0.26) |
Minimum Bond-line Thickness 0.15 (0.97) 0.09 (0.58) 0.06 (0.39) |
Minimum Bond-line Thickness 0.02 (0.13) 0.015 (0.097) 0.0055 (0.035) |
| Operating Temperature Range, F (C) | -67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
(CLICK HERE TO DOWNLOAD T766 SPEC SHEET)
Matrix specializes in precision slitting of tapes to meet the exact specifications required by manufacturers. Our state-of-the-art equipment and expertise ensure precise customization, providing manufacturers with tailored solutions to enhance their product quality and performance.
Matrix Technology is the only authorized distributor of Parker Chomerics products in Canada. We have been working with Canadian engineers and technology companies for 45 years as Canada’s premier engineered materials partner, and have been converting products into customized solutions ever since.
