Phase-Change Thermal Interface Pads
Parker Chomerics THERMFLOW® T777 represents a thermally optimized phase change material with inherent adhesiveness, engineered to comprehensively fill interfacial air gaps and voids within electronic assemblies. It is categorized as a Polymer Solder Hybrid Material (PSH). Maintaining solidity at room temperature, THERMFLOW® materials are easy to handle, ensuring consistent and precise application as dry pads onto heat sinks or component surfaces. As temperatures rise during component operation, the THERMFLOW® material softens, facilitating seamless conformity to both mating surfaces with minimal clamping pressure. Upon reaching the necessary melt temperature, the pad undergoes a complete phase transition, achieving a minimal bond-line thickness (MBLT) of less than 0.001 inch or 0.0254mm, alongside maximum surface wetting. Consequently, this minimizes thermal contact resistance owing to an extremely narrow thermal resistance path.
PRODUCT FEATURES:
- Low thermal impedance
- Demonstrated reliability through thermal cycling and accelerated age testing
- Can be pre-applied to heat sinks
- Protective release liners prevent contamination
- Available in custom die-cut shapes and kiss-cut on rolls
- RoHS compliant
IDEAL APPLICATIONS:
- Microprocessors
- Graphics processors
- Chipsets
- Memory Modules
- Power Modules
- Power Semiconductors
PRODUCT ATTRIBUTES:
- Superior thermal performance
- Ideal solution for mobile microprocessors
- Dispersed solder filler offers added thermal performance
- Resin system designed for higher temperature reliability
- Inherently tacky
- No adhesive required
- Tabs available for easy removal
- UL 94 V-0 flammability rated
| THERMFLOW Comparison | ||||
|---|---|---|---|---|
 |
T710 with PSA | T725 | T766/T766-06 | T777 |
 |
Request Sample | Request Sample | Request Sample | Request Sample |
| Colour | Light Gray/Off-White | Pink | Purple/Gray Foil | Gray |
| Carrier | 2 mil Fiberglass | None – Free Film | 1 mil Metal Foil | None – Free Film |
| Standard Thickness, in (mm) | 0.0055 (0.138) | 0.005 (0.125) | 0.0035 (0.088) 0.006 (0.152) |
0.0045 (0.115) |
| Specific Gravity | 1.15 | 1.1 | 2.6 | 1.95 |
| PRICE (Request Quote) |
$$ | $$ | $$ | $$$ |
| Phase Transition Temperature (C) | 45 | 55 | 55 | 45/62*** |
| Thermal Impedance @ 70 C, C-in^2/W (C-cm^2/W) @ 10 psi (69 kPa) @ 25 psi (172 kPa) @ 50 psi (345 kPa) |
Minimum Bond-line Thickness @ 50 C 0.023 (1.48) 0.16 (1.03) 0.12 (0.77) |
2.9 mil 0.11 (0.71) 0.06 (0.39) 0.04 (0.26) |
Minimum Bond-line Thickness 0.15 (0.97) 0.09 (0.58) 0.06 (0.39) |
Minimum Bond-line Thickness 0.02 (0.13) 0.015 (0.097) 0.0055 (0.035) |
| Operating Temperature Range, F (C) | -67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
-67 to 257 (-55 to 125) |
(CLICK HERE TO DOWNLOAD T777 SPEC SHEET)
Matrix specializes in precision slitting of tapes to meet the exact specifications required by manufacturers. Our state-of-the-art equipment and expertise ensure precise customization, providing manufacturers with tailored solutions to enhance their product quality and performance.
Matrix Technology is the only authorized distributor of Parker Chomerics products in Canada. We have been working with Canadian engineers and technology companies for 45 years as Canada’s premier engineered materials partner, and have been converting products into customized solutions ever since.
