Phase-Change Thermal Interface Pads THERMFLOW® T725 represents a phase change substance tailored for vertical uses, engineered to occupy and seal interfacial air gaps and voids within electronic assemblies. Classified as a Traditional Phase Change Material (PCM), THERMFLOW® materials maintain solidity at room temperature, facilitating easy handling and consistent application as dry pads onto heat sinks … Read more
Phase-Change Thermal Interface Pads THERMFLOW® T710 represents a thermally enhanced phase change substance that necessitates minimal deflection force and is crafted to seamlessly occupy any interfacial air gaps and voids found within electronic assemblies. At ambient temperatures, THERMFLOW® materials retain a solid state, facilitating easy handling and consistent application as dry pads onto heat sinks … Read more
Double Sided Thermal Tapes The THERMATTACH T418 double-sided thermal interface tapes offer exceptional adhesion strength between electronic components and heatsinks, along with optimal conformability to components. Demonstrating outstanding reliability when subjected to thermal, mechanical, and environmental conditions, the THERMATTACH tape family ensures consistent performance. Utilizing thermal tapes enhances design flexibility and streamlines the complexity of … Read more
Double Sided Thermal Tapes The THERMATTACH T411 double-sided thermal interface tapes offer outstanding adhesion between electronic components and heat sinks, particularly effective on plastic packages and materials with low surface energy. Within the THERMATTACH tape range, these products demonstrate remarkable reliability under various thermal, mechanical, and environmental conditions. They enhance design flexibility and simplify electronics … Read more
Thermally Conductive Gap Filler Pads THERM-A-GAP 579 gap filler pads offer a solution with extremely low hardness (30 Shore 00) and boast a thermal conductivity of 3.0 W/m-K. The THERM-A-GAP 5XX series sheets and pads deliver outstanding thermal properties along with exceptional conformability, requiring minimal clamping forces. Representing an economical choice, THERM-A-GAP 579 combines excellent … Read more
Thermally Conductive Gap Filler Pads THERM-A-GAP 569 gap filler pads offer a solution with extremely low hardness (10 Shore 00) and boast a thermal conductivity of 1.5 W/m-K. The THERM-A-GAP 569 series sheets and pads deliver outstanding thermal properties along with exceptional conformability, requiring minimal clamping forces. Representing an economical choice, THERM-A-GAP 569 combines excellent … Read more
Double Sided Thermal Tapes The THERMATTACH T412 double-sided thermal interface tapes offer top-notch thermal conductivity and outstanding bonding capabilities between electronic components and heatsinks. Proven to deliver excellent reliability under thermal, mechanical, and environmental conditions, the THERMATTACH tape series ensures consistent performance. Leveraging thermal tapes enhances design flexibility and simplifies the complexity of electronic assemblies … Read more
Gap filler pads play a critical role in equipment maintenance and ensuring optimal device performance. These pads fill the minute gaps between components and casings, shielding sensitive equipment from potentially damaging high temperatures. Choosing the right material is paramount for effective protection. Thermal Gap Pad Comparison THERM-A-GAP PAD 30 THERM-A-GAP PAD 60 THERM-A-GAP PAD 70TP … Read more
High Performance Fully Cured Dispensable Gel Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP … Read more
High Performance High Flow Fully Cured Dispensable Gel THERM-A-GAP GEL 60HF is part of the Parker Chomerics family of fully cured, one component, silicone-based, dispensable thermal interface materials. With a 6.2 W/m-K thermal conductivity, it is designed for high performance heat transfer from electronics components to cooling features and meant to be used across industries … Read more
Matrix Technology Ltd. complies with the requirements of the Securities and Exchange Commission rule pursuant to Section 1502 of the Dodd - Frank Wall Street Reform and Consumer Protection Act relating to the use of conflict minerals, the European Community Regulation REACH ( Registration, Evaluation, Authorization and Restriction of CHemical substances) controlling chemicals and their safe use and the European Union Directive on the restriction and use of certain hazardous substances in electrical and electronic equipment (RoHS).
Copyright Matrix Technology.
Website by StableWP
