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Parker Chomerics – Thermal Tapes – THERMATTACH 1411

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Double Sided Thermal Tapes The THERMATTACH T411 double-sided thermal interface tapes offer outstanding adhesion between electronic components and heat sinks, particularly effective on plastic packages and materials with low surface energy. Within the THERMATTACH tape range, these products demonstrate remarkable reliability under various thermal, mechanical, and environmental conditions. They enhance design flexibility and simplify electronics … Read more

Parker Chomerics – Thermally Conductive Gap Filler Pads – THERM-A-GAP 579

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Thermally Conductive Gap Filler Pads THERM-A-GAP 579 gap filler pads offer a solution with extremely low hardness (30 Shore 00) and boast a thermal conductivity of 3.0 W/m-K. The THERM-A-GAP 5XX series sheets and pads deliver outstanding thermal properties along with exceptional conformability, requiring minimal clamping forces. Representing an economical choice, THERM-A-GAP 579 combines excellent … Read more

Parker Chomerics – Thermally Conductive Gap Filler Pads – THERM-A-GAP 569

thermagap569

Thermally Conductive Gap Filler Pads THERM-A-GAP 569 gap filler pads offer a solution with extremely low hardness (10 Shore 00) and boast a thermal conductivity of 1.5 W/m-K. The THERM-A-GAP 569 series sheets and pads deliver outstanding thermal properties along with exceptional conformability, requiring minimal clamping forces. Representing an economical choice, THERM-A-GAP 569 combines excellent … Read more

Parker Chomerics – Thermal Tapes – THERMATTACH 1412

Featured Image T412

Double Sided Thermal Tapes The THERMATTACH T412 double-sided thermal interface tapes offer top-notch thermal conductivity and outstanding bonding capabilities between electronic components and heatsinks. Proven to deliver excellent reliability under thermal, mechanical, and environmental conditions, the THERMATTACH tape series ensures consistent performance. Leveraging thermal tapes enhances design flexibility and simplifies the complexity of electronic assemblies … Read more

Protect Equipment with THERM-A-GAP PAD 70TP

THERM-A-GAP PAD 70TP

Gap filler pads play a critical role in equipment maintenance and ensuring optimal device performance. These pads fill the minute gaps between components and casings, shielding sensitive equipment from potentially damaging high temperatures. Choosing the right material is paramount for effective protection. Thermal Gap Pad Comparison THERM-A-GAP PAD 30 THERM-A-GAP PAD 60 THERM-A-GAP PAD 70TP … Read more

Therm-A-Gap Gel 75 – Thermal Gap Gel

High Performance Fully Cured Dispensable Gel Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP … Read more

Therm-A-Gap Gel 60HF – Thermal Gap Gel

GEL60HF

High Performance High Flow Fully Cured Dispensable Gel THERM-A-GAP GEL 60HF is part of the Parker Chomerics family of fully cured, one component, silicone-based, dispensable thermal interface materials. With a 6.2 W/m-K thermal conductivity, it is designed for high performance heat transfer from electronics components to cooling features and meant to be used across industries … Read more

Therm-A-Gap Gel 50VT – Thermal Gap Gel

GEL50VT

High Performance High Reliability Fully Cured Dispensable Thermal Gel Parker Chomerics THERM-A-GAPGEL 50VT is a reworkable, high performance, one-component silicone, dispensable thermal interface gel material with 5.2 W/m-K typical thermal conductivity. GEL 50VT was developed to conduct heat away from electronics to heat sinks or enclosures and to perform reliably in vertical and/or high vibration … Read more

Therm-A-Gap Gel 50TBL – Thermal Gap Gel

GEL50TBL

High Performance Fully Cured Dispensable Thin Bond Line Gel Parker Chomerics THERM-A-GAP GEL 50TBL is a reworkable, high performance, one component, dispensable, thermal interface material with 5.0 W/m-K Bulk typical Thermal Conductivity. GEL 50TBL was developed to conduct heat away from electronics to a heat sink or enclosure at very thin bond lines. At minimum … Read more

Therm-A-Gap Gel 20 – Thermal Gap Gel (Thermal Gel)

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Highly Reliable Fully Cured Dispensable GEL Parker Chomerics THERM-A-GAP GEL 20 is a moderate performance, one component, dispensable thermal interface material with 2.4 W/m-K thermal conductivity developed with high reliability for the automotive industry. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses up to 4mm to suit application needs. THERM-A-GAP GEL … Read more