Thermal

Thermally Conductive Low Compression Force Gap Filler Pad Parker ChomericsTHERM-A-GAPPAD 30 is a thermally conductive, electrically isolating gap filler pad with a thermal conductivity of 3.2 W/m‐K. Designed to provide effective heat transfer between electronic devices, heat sinks, or other cooling features, THERM‐A‐GAP PAD 30 offers the ideal combination of heat transfer, low outgassing, and … Read more

Thermally Conductive Low Compression Force Thermal Putty Parker ChomericsTHERM‐A‐GAP PAD 70TP is a high performance, highly conformable thermally conductive gap filler pad with a typical thermal conductivity of 7.0 W/m‐K. It provides superior thermal performance and long‐term stability over conventional thermal pads with very low compression force. THERM‐A‐GAP PAD 70TP is designed to provide effective … Read more

Thermally Conductive High Performance Gap Filler Pad Parker ChomericsTHERM-A-GAP PAD 80 is a high performance, thermally conductive gap filler pad with a typical thermal conductivity of 8.3 W/m-K.THERM-A-GAPPAD 80 is designed to serve as an effective thermal interface between heat sinks and heat generating components on electronic devices where uneven surfaces, air gaps, and rough … Read more

Thermal gels are used for thermal management primarily because of their ability to efficiently conduct heat away from electronic components or other devices. Here are some reasons why thermal gels are used for this purpose: High Thermal Conductivity: Thermal gels are formulated with materials that have high thermal conductivity, such as silicone or certain polymers. … Read more