8.3 W/m-K Thermally Conductive High Performance Gap Filler Pad The Parker Chomerics THERM-A-GAP™ PAD 80 is a high-performance, thermally conductive gap filler pad with a thermal conductivity of 8.3 W/m-K. It ensures excellent heat transfer across various thicknesses while maintaining low compression forces and conformability between mating surfaces. Designed to be an effective thermal interface, … Read more
Choosing the right silicone foam rubber for your needs can significantly impact the performance and reliability of your applications. Norseal F-20, with its impressive range of properties, offers a superior alternative to the Rogers HT800. Below is a detailed comparison to help you make an informed decision: Key Comparisons: Property Rogers HT800 Saint Gobain F-20 … Read more
Saint Gobain F-12 presents a compelling alternative to the Rogers BF1000, offering an array of benefits that make it a standout choice for various applications. Whether you need a material for high-stress environments, excellent fire safety, or specific environmental and electrical properties, Saint Gobain F-12 has you covered. Additionally, Saint Gobain is known for its … Read more
If you’re looking for a reliable and versatile silicone foam rubber with quick lead times, Saint Gobain F-15 provides a compelling alternative to Rogers HT870. Below is a detailed comparison to help you make an informed decision: Key Comparisons: Property Rogers HT870 Saint Gobain F-15 Thickness 0.063 – 0.500 inches 0.063 – 0.500 inches Density … Read more
3.5 W/m-K Cost Effective, High Reliability, Fully Cured, Dispensable Thermal Gel Parker Chomerics THERM-A-GAP GEL 35VT is a one-component silicone thermal interface gel engineered for reworkability. With a typical thermal conductivity of 3.5 W/m-K, it efficiently transfers heat from electronics to heat sinks or enclosures, making it suitable for vertical orientations and environments with high … Read more
Phase-Change Thermal Interface Pads Parker Chomerics THERMFLOW® T777 represents a thermally optimized phase change material with inherent adhesiveness, engineered to comprehensively fill interfacial air gaps and voids within electronic assemblies. It is categorized as a Polymer Solder Hybrid Material (PSH). Maintaining solidity at room temperature, THERMFLOW® materials are easy to handle, ensuring consistent and precise … Read more
Phase-Change Thermal Interface Pads THERMFLOW® T766 stands out as an inherently adhesive phase change material safeguarded by a foil, meticulously crafted to fill interfacial air gaps and voids within electronic assemblies. Categorized as a Traditional Phase Change Material (PCM), THERMFLOW® materials retain solidity at room temperature, facilitating effortless handling and consistent application as dry pads … Read more
Phase-Change Thermal Interface Pads THERMFLOW® T725 represents a phase change substance tailored for vertical uses, engineered to occupy and seal interfacial air gaps and voids within electronic assemblies. Classified as a Traditional Phase Change Material (PCM), THERMFLOW® materials maintain solidity at room temperature, facilitating easy handling and consistent application as dry pads onto heat sinks … Read more
Phase-Change Thermal Interface Pads THERMFLOW® T710 represents a thermally enhanced phase change substance that necessitates minimal deflection force and is crafted to seamlessly occupy any interfacial air gaps and voids found within electronic assemblies. At ambient temperatures, THERMFLOW® materials retain a solid state, facilitating easy handling and consistent application as dry pads onto heat sinks … Read more
Double Sided Thermal Tapes The THERMATTACH T418 double-sided thermal interface tapes offer exceptional adhesion strength between electronic components and heatsinks, along with optimal conformability to components. Demonstrating outstanding reliability when subjected to thermal, mechanical, and environmental conditions, the THERMATTACH tape family ensures consistent performance. Utilizing thermal tapes enhances design flexibility and streamlines the complexity of … Read more
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