Parker Chomerics THERM-A-GAP™ 569 Thermally Conductive Gap Filler Pads offer an innovative solution for managing thermal performance in electronic applications. With an ultra-low hardness rating of just 10 Shore 00, these gap filler pads are designed to conform easily to irregular surfaces, minimizing stress on delicate components. Featuring a thermal conductivity of 1.5 W/m-K, they … Read more
How Tapes Enhance the Longevity and Performance of LEDs LED (Light Emitting Diode) lighting is celebrated for its energy efficiency, durability, and long service life. As urban modernization accelerates, LEDs are redefining illumination by lighting up building interiors and exteriors, highways, parks, and other public spaces. Behind the scenes, tapes and foam materials are essential … Read more
Selecting the right thermal gap filler is crucial for effective thermal management in electronic applications. In this blog post, we will compare three popular thermal gap filler products from Fujipoly, Laird, and Henkel, as well as Parker Chomerics’ THERM-A-GAP PAD 30. Each product offers unique advantages and can be suitable for different applications. 1. Therm-A-Gap … Read more
Battery energy storage systems (BESS) are increasingly widespread, from large institutions to individual homes. These systems store electrical energy for future use, providing essential backup or auxiliary power and can serve as portable battery storage solutions. BESS are typically categorized into three main tiers: Grid-level storage is used in applications like large solar arrays, wind … Read more
6.0 W/m-K Dispensable Thermal Cure-in-Place and Gap Filler Material Parker Chomerics THERM-A-FORM CIP 60 is a high-performance, two-component (2k) thermal gap filler and cure-in-place material with a thermal conductivity of 6.0 W/m-K, making it ideal for applications requiring effective heat dissipation. Once fully cured, it achieves a Shore 00 hardness of 50, providing a softer, … Read more
Leading telecom providers are diligently addressing various technical challenges to realize the full potential of 5G. This effort will result in a higher concentration of components within more compact spaces, driving the demand for effective electromagnetic compatibility (EMC) and thermal management solutions. 5G wireless technology is set to deliver reliable multi-gigabit peak data speeds, low … Read more
Saint-Gobain® Tape Solutions focuses on supporting customer needs through customization, testing, and simulation. The team often addresses thermal insulation and fire mitigation for EV battery packs, modules, and cells. Leveraging global teams, material expertise, and strong simulation and testing capabilities is crucial for meeting specific customer requirements and creating products tailored to diverse battery configurations. … Read more
High Performance High Flow Rate Fully Cured Dispensable Gel THERM-A-GAP GEL 60HF, part of the Parker Chomeric’s family, is a fully cured, one-component, silicone-based thermal interface material with a thermal conductivity of 6.2 W/m-K. Designed for high-performance heat transfer from electronic components to cooling features, it is suitable for a wide range of industries and … Read more
High Performance Non-Silicone Fully Cured Dispensable Gel THERM-A-GAP GEL 40NS is a high-performance, one-component, urethane-based thermal interface gel with a thermal conductivity of 4.0 W/m-K. It’s designed to transfer heat from electronics to a heat sink or enclosure. The “NS” suffix indicates it is non-silicone, making it suitable for applications where silicone contamination is a … Read more
Thermally Conductive Low Compression Force Gap Filler Pad Parker Chomerics THERM-A-GAP PAD 60 is a high-performance thermal interface material with a thermal conductivity of 6.0 W/m-K. It ensures superior heat transfer and requires low compression forces, maintaining excellent conformability between mating surfaces. The pad combines high thermal conductivity with low outgassing, making it an ideal … Read more
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