Parker Chomerics THERM-A-GAP™ 570 Thermally Conductive Gap Filler Pads offer a soft, highly conformable thermal interface solution with a 25 Shore 00 hardness and 1.5 W/m-K thermal conductivity. Engineered for low clamping force applications, these pads excel in molding complex geometries and providing effective vibration dampening while maintaining excellent thermal properties. Key Features & Benefits … Read more
Parker Chomerics THERM-A-GAP™ PAD 60 is a soft, high-performance thermally conductive gap filler pad with a thermal conductivity of 6.0 W/m-K and a 31 Shore 00 hardness. Designed for exceptional thermal transfer and ultra-low deflection force, this gap filler provides a highly effective interface between heat sinks and electronic components, especially where uneven surfaces, air … Read more
Parker Chomerics THERM-A-GAP™ PAD 80 is a high-performance, thermally conductive gap filler pad with a thermal conductivity of 8.3 W/m-K. It effectively transfers heat across various thicknesses while maintaining low compression force and excellent conformability between mating surfaces. Designed for use between heat sinks and heat-generating components, PAD 80 accommodates uneven surfaces, air gaps, and … Read more
THERM-A-GAP™ 580 Thermally Conductive Gap Filler Pads THERM-A-GAP™ 580 gap filler pads provide moderate hardness (75 Shore 00) with a thermal conductivity of 3.0 W/m-K. Designed for optimal thermal performance and maximum conformability at low clamping forces, these pads are ideal for molding complex components, minimizing vibration, and reducing outgassing. THERM-A-GAP™ 580 is available in … Read more
Parker Chomerics THERM-A-GAP PAD 30 is a thermally conductive gap filler pad featuring a thermal conductivity of 3.2 W/m-K and a Shore 00 hardness of 34. As the latest addition to the THERM-A-GAP thermal pad family, PAD 30 combines exceptional thermal performance with excellent conformability and minimal outgassing. It provides an efficient thermal interface for … Read more
Parker Chomerics THERM-A-GAP™ 569 Thermally Conductive Gap Filler Pads offer an innovative solution for managing thermal performance in electronic applications. With an ultra-low hardness rating of just 10 Shore 00, these gap filler pads are designed to conform easily to irregular surfaces, minimizing stress on delicate components. Featuring a thermal conductivity of 1.5 W/m-K, they … Read more
How Tapes Enhance the Longevity and Performance of LEDs LED (Light Emitting Diode) lighting is celebrated for its energy efficiency, durability, and long service life. As urban modernization accelerates, LEDs are redefining illumination by lighting up building interiors and exteriors, highways, parks, and other public spaces. Behind the scenes, tapes and foam materials are essential … Read more
Selecting the right thermal gap filler is crucial for effective thermal management in electronic applications. In this blog post, we will compare three popular thermal gap filler products from Fujipoly, Laird, and Henkel, as well as Parker Chomerics’ THERM-A-GAP PAD 30. Each product offers unique advantages and can be suitable for different applications. 1. Therm-A-Gap … Read more
Battery energy storage systems (BESS) are increasingly widespread, from large institutions to individual homes. These systems store electrical energy for future use, providing essential backup or auxiliary power and can serve as portable battery storage solutions. BESS are typically categorized into three main tiers: Grid-level storage is used in applications like large solar arrays, wind … Read more
6.0 W/m-K Dispensable Thermal Cure-in-Place and Gap Filler Material Parker Chomerics THERM-A-FORM CIP 60 is a high-performance, two-component (2k) thermal gap filler and cure-in-place material with a thermal conductivity of 6.0 W/m-K, making it ideal for applications requiring effective heat dissipation. Once fully cured, it achieves a Shore 00 hardness of 50, providing a softer, … Read more
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