Thermal

As AI electronics continue pushing performance boundaries—from powerful datacenter accelerators to edge AI modules—the demand for advanced thermal solutions has never been greater. Today’s AI chips routinely operate at power densities exceeding 200 W/cm², generating hotspots that demand meticulous thermal management to maintain performance and reliability. 1. Why AI Processors Need Superior Thermal Materials Modern AI … Read more

In mission-critical applications, thermal performance isn’t optional—it’s the difference between uptime and failure. When typical overseas-sourced thermal interface materials (TIMs) fall short—whether due to inconsistent performance, low conductivity, or poor manufacturability—Matrix Technology delivers the proven alternative. With over 40 years of expertise, Matrix offers the most comprehensive, technically verified selection of TIMs on the market—ready … Read more

As the world races toward ever more powerful computing, the challenge of heat management has never been more critical. Nowhere is this more evident than in AI-driven systems powered by high-performance chips from NVIDIA, AMD, Intel, and others. For over 40 years, Matrix Technology has been at the forefront of thermal management solutions—delivering the industry’s … Read more

Thermal Interface Solutions for Next-Gen Electronics Thermal gap filler pads—commonly referred to as gap pads—are crucial interface materials placed between heat-generating components (such as CPUs, GPUs, memory chips, and radar systems) and heat-dissipating elements (like heat sinks, cold plates, heat pipes, and vapor chambers). As processing power and electronic density continue to increase, the demand … Read more

Advancing EV and Hybrid Technology with Efficient Thermal Management As electric vehicles (EVs) and hybrid electric vehicles (HEVs and PHEVs) become more widespread, the need to minimize the environmental impact of traditional internal combustion engine (ICE) vehicles continues to grow. Unlike gasoline-powered vehicles that rely on stored chemical energy, EVs and hybrids utilize large battery … Read more

Thermal interface materials (TIMs) play a crucial role in improving heat transfer between electronic components and their cooling solutions, such as heat sinks, vapor chambers, or cooling pipes. By filling microscopic air gaps that naturally form during assembly, TIMs enhance thermal conductivity and improve overall device performance. A TIM is primarily composed of two key … Read more

As electric vehicles (EVs), hybrid electric vehicles (HEVs and PHEVs), and their charging infrastructure become more widespread, manufacturers face new engineering challenges. The push for sustainable transportation demands efficient storage and delivery of electrical energy, requiring battery systems that are not only powerful but also highly efficient. To achieve this, battery packs must become more … Read more

Parker Chomerics THERM-A-GAP™ 579 Thermally Conductive Gap Filler Pads deliver exceptional thermal performance with a soft, 30 Shore 00 hardness and a thermal conductivity of 3.0 W/m-K. Designed for maximum conformability at minimal clamping forces, these gap-filler sheets and pads provide superior heat dissipation while maintaining low outgassing properties. Carrier Options THERM-A-GAP 579 is available … Read more

Parker Chomerics THERM-A-GAP™ 570 Thermally Conductive Gap Filler Pads offer a soft, highly conformable thermal interface solution with a 25 Shore 00 hardness and 1.5 W/m-K thermal conductivity. Engineered for low clamping force applications, these pads excel in molding complex geometries and providing effective vibration dampening while maintaining excellent thermal properties. Key Features & Benefits … Read more

Parker Chomerics THERM-A-GAP™ PAD 60 is a soft, high-performance thermally conductive gap filler pad with a thermal conductivity of 6.0 W/m-K and a 31 Shore 00 hardness. Designed for exceptional thermal transfer and ultra-low deflection force, this gap filler provides a highly effective interface between heat sinks and electronic components, especially where uneven surfaces, air … Read more