Thermal

Thermal Interface Solutions for Next-Gen Electronics Thermal gap filler pads—commonly referred to as gap pads—are crucial interface materials placed between heat-generating components (such as CPUs, GPUs, memory chips, and radar systems) and heat-dissipating elements (like heat sinks, cold plates, heat pipes, and vapor chambers). As processing power and electronic density continue to increase, the demand … Read more

Advancing EV and Hybrid Technology with Efficient Thermal Management As electric vehicles (EVs) and hybrid electric vehicles (HEVs and PHEVs) become more widespread, the need to minimize the environmental impact of traditional internal combustion engine (ICE) vehicles continues to grow. Unlike gasoline-powered vehicles that rely on stored chemical energy, EVs and hybrids utilize large battery … Read more

Thermal interface materials (TIMs) play a crucial role in improving heat transfer between electronic components and their cooling solutions, such as heat sinks, vapor chambers, or cooling pipes. By filling microscopic air gaps that naturally form during assembly, TIMs enhance thermal conductivity and improve overall device performance. A TIM is primarily composed of two key … Read more

As electric vehicles (EVs), hybrid electric vehicles (HEVs and PHEVs), and their charging infrastructure become more widespread, manufacturers face new engineering challenges. The push for sustainable transportation demands efficient storage and delivery of electrical energy, requiring battery systems that are not only powerful but also highly efficient. To achieve this, battery packs must become more … Read more

Parker Chomerics THERM-A-GAP™ 579 Thermally Conductive Gap Filler Pads deliver exceptional thermal performance with a soft, 30 Shore 00 hardness and a thermal conductivity of 3.0 W/m-K. Designed for maximum conformability at minimal clamping forces, these gap-filler sheets and pads provide superior heat dissipation while maintaining low outgassing properties. Carrier Options THERM-A-GAP 579 is available … Read more

Parker Chomerics THERM-A-GAP™ 570 Thermally Conductive Gap Filler Pads offer a soft, highly conformable thermal interface solution with a 25 Shore 00 hardness and 1.5 W/m-K thermal conductivity. Engineered for low clamping force applications, these pads excel in molding complex geometries and providing effective vibration dampening while maintaining excellent thermal properties. Key Features & Benefits … Read more

Parker Chomerics THERM-A-GAP™ PAD 60 is a soft, high-performance thermally conductive gap filler pad with a thermal conductivity of 6.0 W/m-K and a 31 Shore 00 hardness. Designed for exceptional thermal transfer and ultra-low deflection force, this gap filler provides a highly effective interface between heat sinks and electronic components, especially where uneven surfaces, air … Read more

Parker Chomerics THERM-A-GAP™ PAD 80 is a high-performance, thermally conductive gap filler pad with a thermal conductivity of 8.3 W/m-K. It effectively transfers heat across various thicknesses while maintaining low compression force and excellent conformability between mating surfaces. Designed for use between heat sinks and heat-generating components, PAD 80 accommodates uneven surfaces, air gaps, and … Read more

THERM-A-GAP™ 580 Thermally Conductive Gap Filler Pads THERM-A-GAP™ 580 gap filler pads provide moderate hardness (75 Shore 00) with a thermal conductivity of 3.0 W/m-K. Designed for optimal thermal performance and maximum conformability at low clamping forces, these pads are ideal for molding complex components, minimizing vibration, and reducing outgassing. THERM-A-GAP™ 580 is available in … Read more

Parker Chomerics THERM-A-GAP PAD 30 is a thermally conductive gap filler pad featuring a thermal conductivity of 3.2 W/m-K and a Shore 00 hardness of 34. As the latest addition to the THERM-A-GAP thermal pad family, PAD 30 combines exceptional thermal performance with excellent conformability and minimal outgassing. It provides an efficient thermal interface for … Read more