A leading manufacturer of premium automotive infotainment and entertainment systems needed a high-performance thermal interface material that could fill five distinct locations on the PCB, each with varying footprints and gap heights.
Customer Challenge
A leading automotive system manufacturer sought a high-performance thermal interface material (TIM) for their infotainment and entertainment module. This TIM needed to effectively fill five different locations on their PCB, each with varying footprints and gap heights. The customer required assistance in selecting the appropriate material and determining the correct dispensing amounts for each location, along with equipment suitable for high-volume production. To complicate matters, the material would undergo a solder reflow process with temperatures reaching up to 245°C, while the upper operating temperature for TC50 (and silicone-based gels) is 200°C.
Design Requirements
- Ensure effective thermal dissipation
- Minimize stress on components
- Easy to dispense
- Withstand the solder reflow process
Key Customer Requirements
- High thermal conductivity (5 W/m-K) and easily dispensable
- Reliable adhesion to the PCB
- Dispensing solution (vendor and equipment)
- No alteration in thermal or mechanical properties after exposure to 245°C for 1 minute during the solder reflow process
Solution
The customer provided Parker Chomerics with a PCB, which was then accurately replicated by our skilled Applications Engineering team using an in-house 3D printer.
The 3D-printed prototype parts enhanced the five dispensing locations, allowing for precise identification of each dispense point.
At our advanced applications engineering lab in Woburn, MA, we utilized a dispensing system from PVA to apply THERM-A-GAP TC50, chosen for its high thermal conductivity, onto the 3D-printed parts for testing and evaluation. The prototypes successfully mimicked the actual PCB.
The customer visited the applications lab to observe the dispensing process and determined that THERM-A-GAP TC50, along with the PVA equipment, would be suitable for their high-volume production needs.
To assess the impact of extreme temperature conditions on THERM-A-GAP TC50, we conducted experiments to evaluate the thermal and mechanical properties of the thermal compound. THERM-A-GAP TC50 samples were subjected to the 245°C solder reflow process, and the results indicated that the thermal interface and viscosity remained stable throughout the extended exposure.
Results
Parker Chomerics chose THERM-A-GAP TC50 for its excellent thermal performance and ease of dispensing onto complex components. Leveraging our application engineering team’s expertise in 3D printing prototype parts and our engineering lab, which we encourage customers to utilize, the Parker Chomerics team was able to deliver a complete solution to the customer within one week of receiving the parts for testing.
After presenting the experimental results to the customer, both Parker Chomerics and the customer tested a complete assembly (PCB board with THERM-A-GAP TC50 and a cover) under the actual solder reflow profile. The tests revealed that the material retained its rheological structure and intended thermal properties throughout the process.