Parker Chomerics THERM-A-GAP™ PAD 80LO is a premium thermal gap filler designed to deliver high performance and long-term reliability across various industries, including advanced computing, defense, telecommunications, and automotive electronics. With a thermal conductivity of 8.0 W/m-K, it effectively manages heat transfer while addressing concerns of silicone oil migration. The “LO” designation, meaning “Low Oil,” highlights its low silicone oil bleed, making it ideal for environments sensitive to silicone contamination, such as automotive and high-tech manufacturing.
PAD 80LO features a Shore 00 hardness of 60 and offers exceptional stress relaxation, reducing compression force by nearly 90% after just one hour. This property ensures minimal stress on sensitive components like integrated circuits, while also providing vibration dampening and maintaining strong thermal contact across uneven or textured surfaces.
Available in standard thicknesses ranging from 0.040” to 0.200” (1.0 mm to 5 mm), PAD 80LO is versatile, providing optimal thermal management while preserving mechanical integrity. It can be supplied in sheets or custom die-cut sizes, ensuring easy integration into complex designs for mission-critical applications.
Product Features:
- High thermal performance: 8.0 W/m-K conductivity
- Very low oil bleed and migration
- Very low compression force post-relaxation
- High tack surface reduces contact resistance
- Electrically isolating
- UL 94 V-0 flammability rating
Typical Applications:
- High performance computing, GPUs, CPUs and memory modules
- 5G and Telecomm equipment • Automotive sensors and devices
- Battery and energy storage modules
- Defense electronics
