CHO-BOND high-performance conductive adhesive is a two-component, silver-filled epoxy engineered for thin bond lines and precision applications. This silver-colored epoxy is ideal for tight spaces and delicate electrical components, providing exceptional conductivity and strong adhesion.
Key Features & Benefits
-
Premium conductivity – Silver filler ensures excellent electrical bonding
-
Superior conductivity levels – 0.002 ohm-cm for reliable performance
-
Strong adhesion – >1200 PSI lap shear strength for durable bonding
-
Easy application – Thin paste consistency allows dispensing through fine needles, ideal for filling small cracks and voids
-
Fast curing – Cures in 15 minutes at 113°C, with room temperature curing options available
-
Low VOC formulation – Environmentally friendly with minimal volatile emissions
-
Pre-measured syringes – Eliminates the need for manual mixing and measuring
Common Applications
-
Bonding electrical enclosures
-
Grounding electrical components
-
Cold soldering alternative
-
Sealing and bonding machined enclosures
For precision bonding and superior conductivity, trust Matrix Technology’s conductive adhesive to deliver reliable performance in demanding electrical applications.
