If you’re in the market for a reliable phase change material (PCM) with fast lead times, Chomerics ThermFlow T777 offers a compelling alternative to the Berquist THF 5000UT. Here’s a detailed comparison to help you make an informed decision:
Thermal Impedance (ASTM D5470):
| Category | Berquist THF 5000UT | Chomerics ThermFlow T777 |
|---|---|---|
| @ 50 PSI | 0.013 | 0.0055 |
| @ 25 PSI | 0.015 | 0.015 |
| @ 10 PSI | 0.016 | 0.002 |
Other Key Comparisons:
| Category | Berquist THF 5000UT | Chomerics ThermFlow T777 |
|---|---|---|
| Appearance | Gray | Gray |
| Transition Temperature | 45 degrees | 45 degrees |
| Flammability Rating | UL-94 V0 | UL-94 V0 |
Performance Analysis
-
Thermal Impedance at 50 PSI:
- Chomerics ThermFlow T777 demonstrates significantly lower thermal impedance (0.0055 vs. 0.013), making it a superior choice for high-pressure applications where efficient heat transfer is critical.
-
Thermal Impedance at 25 PSI and 10 PSI:
- Both products perform comparably at 25 PSI (0.015) and have slight differences at 10 PSI (0.016 for Berquist vs. 0.02 for Chomerics). These values indicate similar performance in medium and low-pressure scenarios, ensuring flexibility depending on the specific requirements of your application.
Berquist/Henkel produces high-quality phase change materials like the THF 5000UT, known for reliable performance and safety standards. However, Chomerics offers a compelling alternative with its ThermFlow T777, which provides equally strong thermal management capabilities. Notably, ThermFlow T777 has a lower thermal impedance at higher pressures and matches Berquist in other key specifications. The standout advantage of Chomerics is its fast lead times, ensuring that high-performing materials are more readily available when needed. This makes Chomerics ThermFlow T777 a practical choice for efficient, reliable thermal solutions.
