Electronics continue to push thermal boundaries—higher power densities, tighter packaging, and more heat-generating components with less margin for error. Matrix supplies Parker Chomerics THERM-A-GAP GEL 120, a fully cured, one-component dispensing gel with a thermal conductivity of 12.0 W/m-K, engineered for high-reliability and high-volume environments.
Why High-Conductivity Gels Matter in Modern Thermal Design
As assemblies become more complex, many designs must accommodate uneven component heights, tight mechanical envelopes, and sensitive structures. Traditional pads can introduce excess stress, while lower-performance gels fail to move heat efficiently.
THERM-A-GAP GEL 120 addresses these challenges by providing:
- High thermal transfer efficiency
- Low mechanical stress
- Tight bond line control
- Reworkability during maintenance
- Compatibility with automated dispensing
Matrix distributes Parker Chomerics’ full thermal portfolio, including Thermal Gap Pads, Thermal Dispensing Gels, Phase Change Materials (PCMs), and the broader Thermal Management category.
Key Advantages of THERM-A-GAP GEL 120
High Thermal Conductivity
The 12.0 W/m-K conductivity rating enables significant reduction in junction temperatures and supports thermal stability under heavy load.
One-Component, Fully Cured Material
No mixing. No waiting. No secondary curing. This reduces process risk and ensures consistent thermal and mechanical performance.
Low Compression Stress
GEL 120 conforms under minimal force, protecting solder joints, fragile components, and sensitive sensors—critical in high-reliability electronics.
Automation-Ready for High-Volume Production
The material’s consistency supports:
- Robotic dispensing
- Repeatable bead placement
- Tight bond line thickness control
- High-throughput, low-variability production
Reworkable
The gel can be removed and reapplied, simplifying maintenance, repair, and upgrade cycles—unlike thermally conductive adhesives or certain PCMs.
Typical Application Areas
THERM-A-GAP GEL 120 is well-suited for:
- Telecommunications hardware
- Automotive ECUs and sensor modules
- Mission-critical industrial electronics
- Energy storage and battery systems
- Consumer and prosumer electronics
Matrix can help integrate GEL 120 alongside complementary TIMs for optimized stack-ups.
Technical Performance Snapshot
- Thermal conductivity: 12.0 W/m-K
- Thin bond line control (approx. 0.010 in)
- Operating temperature range suitable for harsh environments
- UL 94 V-0 flammability rating
- Low outgassing for sensitive systems
- Stable dielectric performance
- Defined shelf life under recommended storage conditions
How Matrix Supports Your Thermal Strategy
Matrix does not manufacture Parker Chomerics materials—we distribute, convert, and support them. Our team assists with:
- Thermal material selection
- Gap and stack-up analysis
- Dispensing process recommendations
- Prototyping-to-production transitions
- Integrating TIMs with EMI shielding when required
Our expertise covers the full range of Matrix EMI Shielding Products and thermal materials for integrated system needs.
Frequently asked questions
Matrix supplies the following Parker Chomerics part numbers:
- 65-00-GEL120-0010 — 10cc Luer-Lock manual syringe
- 65-00-GEL120-0300 — 12oz (300cc) aluminum cartridge
- 65-02-GEL120-0030 — 30cc EFD plastic cartridge
- 65-02-GEL120-0180 — 6oz (180cc) EFD plastic cartridge
- 65-1P-GEL120-2500 — 1 U.S. gal. pail
Matrix offers:
- EMI gaskets
- Ventilation panels
- Microwave absorbers
- Conductive plastics
- RF shields and cans
- Conductive coatings, inks, adhesives, and sealants
- Cable shielding solutions
View the full range:Â Matrix EMI Shielding Products
GEL 120 is ideal for variable gaps, automated dispensing, and low-mechanical-stress environments.
For uniform gaps, consider Thermal Gap Pads.
For temperature-cycling applications requiring melt/reflow performance, evaluate Phase Change Materials (PCMs).
No. It is fully cured as supplied and does not require any secondary curing steps.
