As the world races toward ever more powerful computing, the challenge of heat management has never been more critical. Nowhere is this more evident than in AI-driven systems powered by high-performance chips from NVIDIA, AMD, Intel, and others. For over 40 years, Matrix Technology has been at the forefront of thermal management solutions—delivering the industry’s most comprehensive selection of Thermal Interface Materials (TIMs) designed for the most demanding applications.
AI Chips Demand Next-Level Cooling
AI workloads push silicon to its limits, often under continuous operation and intense computational strain. From NVIDIA H100s in server racks to edge AI modules driving robotics, performance is heat-limited. Keeping these chips within safe thermal envelopes is essential to maintain speed, reduce throttling, and ensure long-term reliability.
This is where Matrix Technology’s TIM portfolio becomes essential. We offer thermal pads ranging from 1 to 13 W/m·K, supporting a broad spectrum of performance and budget requirements. These pads are ideal for cooling:
- NVIDIA AI accelerators (H100, A100, Orin, Jetson series)
- AMD EPYC and Ryzen chips
- Intel Xeon and Core series
- Custom ASICs and FPGAs for edge and embedded AI
Customization That Meets Engineering Demands
Every application is unique—so is your thermal solution. Matrix Technology offers precision die-cut and custom-shaped thermal pads to suit your specific board layout, stack-up, and form factor. Whether your design calls for ultra-thin interface layers or thick gap-filling materials, our team can convert standard materials into application-specific TIM configurations with tight tolerances and repeatability.
The Full TIM Spectrum—Not Just Pads
Matrix doesn’t just provide thermal pads—we are your single source for all TIMs used in AI applications, including:
- Thermal pastes and greases for low-resistance joints
- Phase change materials (PCM) for cycling environments
- Graphite and carbon-based materials for ultra-high conductivity
- Gap fillers and thermal gels for conformal applications
- Insulator pads for high-voltage modules
Our thermal interface materials have been trusted in aerospace, telecom, automotive, and now lead the way in AI computing where thermal density is skyrocketing.
Why Engineers Choose Matrix for AI Thermal Solutions
- Broadest TIM selection in North America
- Over 40 years of application engineering support
- AI-ready materials for extreme processing environments
- Rapid prototyping and high-volume production
- Custom die-cut, kiss-cut, and roll-form TIMs
When engineers design with Matrix, they don’t just buy materials—they gain a partner who understands the evolving demands of AI electronics.
Power Up Your AI Designs with Matrix TIMs
Whether you’re cooling an NVIDIA Jetson on a drone, a PCIe accelerator in a data center, or custom silicon in an embedded AI module, Matrix Technology delivers the performance and configurability you need.
Get in touch with our thermal engineers today to spec your next project, or request samples from our AI-ready TIM lineup. Heat won’t wait—and neither should you.
